OpenAI总裁Greg Brockman透露，公司已将其AI模型应用于与博通合作的定制芯片设计中。AI模型能够发现人类设计师需要数周时间才能识别的优化方案，从而实现芯片面积的显著减小和生产周期的缩短。Brockman强调，AI发现的优化并非人类无法想到，而是极大地加速了这一过程。OpenAI正致力于将相关专业知识内置于公司内部，以更深入地理解芯片设计流程。此次合作是OpenAI构建AI基础设施和算力的一部分，旨在推动AI技术发展。

💡AI赋能芯片设计：OpenAI利用其AI模型与博通合作，成功应用于定制芯片的设计过程中。AI模型能够以前所未有的速度发现复杂的优化方案，这些方案若由人类设计师完成，则需要数周甚至更长时间。

🚀效率与成本双重提升：通过AI的辅助设计，芯片实现了“巨大的面积缩减”，这意味着更小巧、更高效的硬件。同时，这一过程还大大缩短了生产周期，为项目推进节省了宝贵的时间。

💡内部能力建设：OpenAI正在积极构建自主的芯片设计专业知识，以期更深入地理解芯片设计的全过程。这种内部能力的提升有助于公司在未来更好地控制和优化其AI基础设施的硬件基础。

🤝战略合作与未来展望：此次与博通的合作是OpenAI构建AI基础设施和算力战略的一部分。双方计划在2026年下半年开始部署定制芯片，并计划在2029年完成，旨在为AI发展提供强大的算力支持，最终服务于全人类。

OpenAI used its AI models to help design custom chips with Broadcom, said Greg Brockman.The OpenAI president said the AI found chip optimizations that would've taken humans weeks to spot.OpenAI has been building that expertise in-house to better understand the chip-design process, he added.

OpenAI's models did what chip engineers could do — only much faster, said OpenAI president Greg Brockman.

Brockman said on an episode of "The OpenAI Podcast" published Monday that the company's models helped uncover chip design optimizations that would have taken human designers weeks to identify.

"We've been able to apply our own models to designing this chip," Brockman said, referring to OpenAI's new custom silicon developed in partnership with Broadcom.

"You take components that humans have already optimized and just pour compute into it, and the model comes up with its own optimizations," he added.

Brockman said the AI-assisted process led to "massive area reductions" on the chip — meaning smaller, more efficient hardware — and shaved weeks off the production schedule.

"I don't think any of the optimizations that we have are ones that human designers couldn't have come up with," he said.

"Our experts take a look at it later, and say, 'Yeah, this was on my list,' but it was like, 20 things that would've taken them another month to get to," he added.

Brockman said OpenAI has been building that expertise in-house to better understand the chip-design process.

His comments came as OpenAI announced a new partnership with Broadcom to co-design custom silicon and build out AI infrastructure and computing power.

The companies said on Monday that they plan to roll out 10 gigawatts worth of custom chips, which Broadcom would deploy by the second half of 2026 and finish in 2029. They will be spread across OpenAI's facilities and partner data centers.

"Developing our own accelerators adds to the broader ecosystem of partners all building the capacity required to push the frontier of AI to provide benefits to all humanity," OpenAI CEO Sam Altman said in Monday's statement.

Brockman and OpenAI did not respond to a request for comment from Business Insider.