钛媒体:引领未来商业与生活新知 10月07日 15:01
OpenAI CEO 访问台湾,洽谈 AI 芯片合作
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OpenAI CEO Sam Altman 近期低调访问台湾,与台积电和富士康等主要制造商会面,探讨 AI 芯片制造和服务器基础设施的合作。此次访问旨在满足 OpenAI 日益增长的硬件需求,特别是为与 Oracle 和软银合作的 Stargate 项目,该项目计划在美国建设大型数据中心,并寻求扩展至中东和韩国。Altman 与台积电的会面预示着 OpenAI 在自研芯片方面的努力,并计划采用台积电先进的 3nm 工艺和 CoWoS 封装技术,预计 2026 年量产。此次台湾之行凸显了台湾在 OpenAI 加强 AI 基础设施建设中的关键作用。

💡 **AI 硬件需求增长与 Stargate 项目**: OpenAI CEO Sam Altman 此次台湾之行,主要目的是为了满足其与 Oracle 和软银合作的 Stargate 项目日益增长的硬件需求。该项目计划在美国建立五个大型数据中心,并可能扩展至中东和韩国,这需要大量的 AI 芯片和服务器基础设施支持。

🚀 **与台积电的芯片合作**: Altman 与全球领先的芯片制造商台积电的会面,是 OpenAI 推进自研芯片的关键一步。据报道,OpenAI 已组建 AI ASIC 设计团队,并计划与博通合作,利用台积电先进的 3nm 工艺和 CoWoS 封装技术,结合高带宽内存(HBM)开发芯片,预计 2026 年实现量产。

🤝 **强化韩国合作伙伴关系**: OpenAI 近期还与韩国的三星和 SK 集团建立了新的战略伙伴关系,作为 Stargate 计划的一部分。这些合作将专注于增加下一代 AI 所需的高级内存芯片供应,并扩大韩国的数据中心容量,使三星和 SK 成为全球 AI 基础设施的重要贡献者。

🌐 **内存芯片供应与数据中心建设**: 三星和 SK Hynix 作为全球顶级的内存芯片制造商,将加速生产先进内存芯片,目标是每月达到 900,000 片 DRAM 晶圆的产量,以满足 OpenAI 对高性能 AI 模型的需求。此外,三星 SDS、C&T 和 Heavy Industries 以及 SK Telecom 也将与 OpenAI 在 AI 数据中心开发、企业 AI 服务以及浮动数据中心等领域展开合作。

TMTPOST --OpenAI CEO Sam Altman recently held low-profile meetings in two major manufacturers based in Taiwan, according to local news media outlet Digital Times.


Credit:IBM

Altman reportedly took a low-profile trip to Taiwan on September 30 to separately meet representatives of Taiwan Semiconductor Manufacturing Company Ltd., (TSMC) and Foxconn, mainly discussing collaboration in AI chip-making and AI server infrastructure development.

The report suggested part of Altman's discussion aims to keep up with OpenAI’s increasing hardware demand for Stargate, an artificial intelligence (AI) infrastructure joint venture founded together with Oracle and SoftBank Group Corp. The venture plans five major datacenters across the United States, and is seeking to expand into the Middle East and South Korea. SoftBank’s CEO Masayoshi Son was also reported to visit Foxconn, underscoring the company’s critical role since it is Oracle’s largest supplier of AI servers.

Altman’s meeting with TSMC, the world’s largest and most advanced chip design and manufacturing company, was deemed as part of preparation for OpenAI’s  in-house chip development. OpenAI reportedly formed an AI ASIC design team last year and is working with Broadcom to develop chips using TSMC’s advanced 3nm manufacturing process.These chips, with chip-on-wafer-on-substrate (CoWoS) packaging technology combined with high-bandwidth memory (HBM), are expected to start mass production in 2026.

Altman’s reported meetings reflected OpenAI’s latest effort to intensify its AI infrastructure, which relies heavily on Taiwan’s semiconductor supply chain. 

OpenAI last week inked new strategic partnerships with two South Korean giants Samsung and SK s part of OpenAI’s Stargate initiative. OpenAI said these partnerships will focus on increasing the supply of advanced memory chips essential for next-generation AI and expanding data center capacity in Korea, positioning Samsung and SK as key contributors to global AI infrastructure and supporting Korea’s ambition to become a top-three global AI nation.

Through these partnerships, Samsung Electronics and SK Hynix, the world’s top two memory chip makers, plan to scale up production of advanced memory chips, targeting 900,000 Dynamic Random-Access Memory (DRAM) wafer starts per month at an accelerated capacity rollout, critical for powering OpenAI’s advanced AI models, according to OpenAI.

Samsung and SK separately announced their Letter of Intents (IOI) signed with OpenAI in Seoul. Starting with the landmark partnership with OpenAI, Samsung said it plans to fully support Korea’s goals to become one of the world’s top three nations in AI and create new opportunities in the field.

Besides the supply of DRAM waters, another Samsung’s unit Samsung SDS has entered into a potential partnership with OpenAI to jointly develop AI data centers and provide enterprise AI services. Samsung C&T and Samsung Heavy Industries will collaborate with OpenAI to advance global AI data centers, with a particular focus on the joint development of floating data centers. These two companies will also explore opportunities to pursue projects in floating power plants and control centers, in addition to floating data center infrastructure.

SK said it will supply High Bandwidth Memory (HBM) for the construction of global AI data center under the Stargate project under the IOL. Noting that OpenAI’s monthly HBM demand for up to 900,000 DARM wafers is more than double the current industry capacity, SK hynix will establish a production system capable of promptly meeting OpenAI’s HBM demand for up to 900,000 DRAM wafers per month.

SK Telecom signed an Memorandum of Understanding (MOU) with OpenAI to collaborate on building a AI Data Center in the southwest region of Korea as part of Stargate, also known as Stargate Korea. Leveraging its solid experience in data center construction and operation, SK Telecom and OpenAI will jointly develop next-generation computing and data center solutions. They will also explore various AI service use cases for consumers and enterprises.  

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OpenAI Sam Altman AI芯片 台积电 TSMC 富士康 Foxconn AI基础设施 Stargate 半导体 三星 SK AI服务器
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