taiyangnews 09月25日
光伏设备:蚀刻与抛光技术概览
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本文基于TaiyangNews的《2025年太阳能电池生产设备市场调查》报告,介绍了深圳S.C公司提供的用于掺杂玻璃蚀刻和抛光的设备。重点关注了SC-LSS14400CS + SCCSZJ14400F-16G集束式解决方案,该方案采用酸性化学品进行蚀刻,并提供高吞吐量,支持M10和G12尺寸晶圆。报告还提及了较旧的SC-LSS7000CS+SC-CSZ7000-14F集束解决方案,其处理较薄晶圆的能力有限。此外,还介绍了SCLSS4200CS在线式设备,适用于PSG蚀刻和表面抛光,主要面向早期单晶PERC生产。

🌟 **集束式解决方案效率高:** Shenzhen S.C提供的SC-LSS14400CS + SCCSZJ14400F-16G集束式解决方案,结合了两种工具,专用于掺杂玻璃的蚀刻与抛光。该方案采用HF基酸性化学品进行掺杂玻璃蚀刻,并使用KOH基碱性化学品处理其他蚀刻步骤。对于M10尺寸的晶圆,其组合吞吐量高达15,120片/小时,即使是G12尺寸也能达到9,600片/小时,并保持99%的机械良率和98%的设备稼动率。

💡 **不同设备满足不同需求:** 除了最新的集束解决方案,深圳S.C还提供了SC-LSS7000CS+SC-CSZ7000-14F这一稍显老旧的集束式解决方案,但其处理140微米厚度以下晶圆的能力有所限制。而SCLSS4200CS则是一款纯在线式设备,专为PSG蚀刻和表面抛光设计,结合了酸碱化学品,适用于M10尺寸晶圆,并配备了多个化学浴槽,最大吞吐量为4,700片/小时,稼动率至少97%,特别适合用于早期单晶PERC生产线。

⚙️ **技术细节与应用场景:** 这些设备在技术细节上各有侧重,如SC-LSS14400CS + SCCSZJ14400F-16G的在线工具拥有10或12个通道,取决于晶圆尺寸。SCLSS4200CS则配置5个并行处理通道,包含3个用于蚀刻和抛光的化学浴槽,以及3个用于冲洗和清洁的浴槽。这些不同配置和性能的设备,为不同代际和不同需求的太阳能电池生产提供了多样化的选择。

Etching of doped glasses such as PSG, along with polishing steps, is typically performed using inline wet-chemical tools or cluster configurations. For the latest TaiyangNews Market Survey on Solar Cell Production Equipment 2025, Shenzhen S.C provided data for 3 such models.

The updated SC-LSS14400CS + SCCSZJ14400F-16G configuration combines 2 tools as part of a cluster solution for doped glass etching and polishing. This solution uses HF-based acidic inline treatment for doped glass etching and KOH-based alkaline chemistry for other etching steps. The inline tool features 10 or 12 lanes, depending on wafer size. The combined throughput is 15,120 wafers per hour for M10 wafers, dropping to 9,600 for G12 wafers. While the tool has the same mechanical yield as the other tools of the company, rated at 99% and its uptime is 98%. The company’s other cluster solution, SC-LSS7000CS+ SC-CSZ7000-14F, also promoted for the same application, is somewhat older. Its ability to process thinner wafers is limited to 140 μm. The number of parallel lanes the inline part can handle varies between 5 and 10, depending on the wafer size, although the details are not provided. The solution supports throughputs of 8,500 M10 wafers or 7,000 G12 wafers per hour.

The third tool from Shenzhen S.C, the SCLSS4200CS, represents the company’s inline-only solution designed for PSG etching and surface polishing. It uses a combination of acidic and alkaline chemistries and supports wafer sizes up to M10, with thicknesses ranging from 140 to 200 μm. It is configured with 5 parallel processing lanes and features 3 chemical baths for active etching and polishing, along with 3 additional baths for rinsing and cleaning. It achieves a maximum throughput of 4,700 wafers per hour while delivering an uptime of at least 97%, like the SC-LSS7000CS + SCCSZ7000-14F cluster. These specs make it most suited for earlier-generation mono-PERC production.

The text is an edited excerpt from TaiyangNews’ latest Market Survey on Solar Cell Production Equipment 2025, which can be downloaded for free here.

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光伏设备 太阳能电池 蚀刻 抛光 Shenzhen S.C TaiyangNews Solar Cell Production Equipment Etching Polishing
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